Cyanide-free immersion gold plating solution for Ni base layers "Aurexel DP"
Achieve uniform Au thin films with a cyanide-free substitutional electroless gold plating solution!
“Aurexel DP” is a cyanide-free substitutional electroless gold plating solution for Ni substrates, offering excellent deposition uniformity and solder wettability, and enabling processing under neutral conditions at low temperatures. 【Features】 ■ Enables the formation of gold thin films using a plating solution that does not contain cyanide compounds ■ Ideal for final surface treatment of substrates and for base-layer formation in reductive gold plating. ■ Damage to the underlying nickel can be minimized through component adjustment ■ Excellent operability due to the ability to process in a neutral range and at low temperatures ■ Low gold content, providing excellent cost performance
